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Applications of Experimental Mechanics of Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and ... 1997, Dallas, Texas (Eep (Series), Vol. 22.)

Author: Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta
Creators: J. C. Suhling, Kenneth M. Liechti, S. Liu, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
Publisher: Amer Society of Mechanical

Buy New: $80.00
as of 2/10/2012 22:18 MST details

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Seller: Amazon.com

Languages: English (Unknown), English (Original Language), English (Published)
Media: Hardcover
Pages: 136

ISBN: 0791818500
EAN: 9780791818503
ASIN: 0791818500

Publication Date: January 1997
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