| Modeling the dielectric response of unsaturated polyester resin during cure.: An article from: Polymer Engineering and Science |  | Authors: D. Alperstein, M. Narkis, A. Siegmann
Publisher: Society of Plastics Engineers, Inc.
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Format: HTML
Language: English (Published)
Media: Digital
Pages: 10
ASIN: B00093HZ4M
Publication Date: February 15, 1995
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This digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on February 15, 1995. The length of the article is 2994 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
From the author: The dielectric relaxation of unsaturated polyester resin during cure was modeled using a modified Williams-Watts decay function. The dielectric response was studied using dielectric measurements coupled with two dynamic mechanical measurement methods. It was found that the variation of the relaxation time during cure is a WLF process using [T.sub.g]([Alpha]) ([Alpha]-conversion) as the varied temperature. It was shown that this process fits the Williams-Watts decay function [Phi](t) = exp(-[(t/[Tau]).sup.[Beta]]) where [Tau]-relaxation time and [Beta]-empirical parameter are time dependent. It was found that [Tau] obeys a time dependent power law rule and [Beta] depends linearly on log(time). Using this modified decay function, it was shown that the experimental dielectric response measured during cure agrees well with the computed response. Relaxation times above and below the dielectric measurement system capability were computed thus, demonstrating the capability of yielding the entire relaxation times spectrum during cure, out of a single limited frequency dielectric measurement.
Citation Details
Title: Modeling the dielectric response of unsaturated polyester resin during cure.
Author: D. Alperstein
Publication: Polymer Engineering and Science (Refereed)
Date: February 15, 1995
Publisher: Society of Plastics Engineers, Inc.
Volume: v35 Issue: n3 Page: p284(5)
Distributed by Thomson Gale
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